About Relooc
Chenda Industrial Co., Ltd. specializes in the research, design, manufacturing, and sales of thermal management solutions. We provide high-performance, reliable, and optimized cooling solutions for a wide range of applications, including information technology equipment, automotive and industrial control systems, office equipment, and consumer electronics. With comprehensive in-house manufacturing capabilities, Chenda is a trusted partner for advanced thermal management solutions.
Our core mission is to solve heat accumulation challenges in PCs, enclosed cooling systems, and electronic airflow applications. Through continuous innovation and engineering excellence, we have become an important contributor to the advancement of thermal management technologies for the computer and electronics industries.
Supported by an experienced management team and highly efficient manufacturing operations, Chenda implements standardized processes throughout product design, development, mass production, and supply chain management. Combined with rigorous quality control systems, we consistently deliver stable product quality, shorter lead times, and greater customer satisfaction.
Working closely with customers from the earliest stages of product development, we provide customized thermal solutions, comprehensive engineering support, and responsive after-sales service. Guided by our customer-oriented philosophy and commitment to sustainable growth, Chenda has established long-term partnerships with leading companies such as King Yuan Electronics, DFI, AVerMedia, Axiomtek, Portwell, and Acrosser, continuing to drive innovation and business growth together.
Advancing Thermal Management for the AI Era
As Artificial Intelligence (AI), High-Performance Computing (HPC), data centers, and edge computing continue to evolve rapidly, increasing chip power density and thermal loads have made thermal management a critical factor affecting system stability, computing performance, and long-term reliability.
To address these challenges, Chenda has proactively invested in next-generation cooling technologies, delivering integrated thermal management solutions designed to meet the demanding requirements of future high-performance computing platforms.
一、High-Performance Cooling Technologies for AI Applications
Chenda continuously invests in the development of advanced thermal solutions for AI servers, GPUs, ASICs, and high-performance computing platforms. Our technologies include high-thermal-conductivity materials, heat pipe assemblies, liquid cooling systems, and hybrid cooling designs, enabling efficient heat dissipation under high TDP, high heat flux, and continuous heavy-duty operating conditions.
二、System-Level Thermal Optimization
Beyond individual cooling components, Chenda provides comprehensive system-level thermal engineering. By collaborating closely with customers on thermal architecture planning and simulation analysis, we optimize airflow management and heat transfer paths to maximize system performance, extend equipment lifespan, and reduce overall energy consumption.
三、Smart Manufacturing and Quality Assurance
To meet the stringent reliability and consistency requirements of AI infrastructure, Chenda is continuously enhancing its manufacturing capabilities through automation and advanced quality management systems. These improvements ensure stable mass production, high manufacturing yields, and consistent product performance that meet the demanding standards of enterprise and data center applications.
四、Growing Together with the AI Ecosystem
Looking ahead, Chenda will continue to follow the evolution of AI technologies and next-generation computing architectures. By strengthening collaboration with semiconductor companies, system integrators, and cloud service providers, we will continue to develop more energy-efficient, higher-performance thermal solutions and serve as a trusted technology partner in the AI era.
